System

Ammonia Diluting / Supplying System

Ammonia Diluting / Supplying System

System designed to blend various chemicals and supply.
Dilute and blend fluoric acid, ammonia water, etc.
and supply to cleaning system from buffer tank.
High precision weighing method enables to form low density HF solution, etc. Layout design to facilitate to replace consumables such as pump, etc. and reduce maintenance work load.

Container Cleaning System

Container Cleaning System

Developed for precision cleaning of 300mm wafer shipping container(FOSB) and FOUP.
System incorporated various know-how required for wafer container cleaning.
Realized high throughput by spray cleaning with high function cleaning agent, air blow water-off, etc. Exhibit same performance also in cleaning of other container such as Open Cassette, SMIF Pod, etc. as well as FOSB/FOUP.
Function as dedicated machine to each work by cleaning jig and most suitable nozzle design/layout corresponding to each work.

12" Cassette-less Cleaning System

12" Cassette-less Cleaning System

Has 300mm wafer cassette-less processing capacity in maximum 50-wafer half pitch/batch. Perform wet-in/dry-out and dy-in/dry-out.
Full automatic operation is available by host communication.
Fully customized system for cleaning process with flexible tank configuation designed to meet various cleaning needs.
Many actual achievements as mass production system.

4"/5"/6"/8" Wafer Etching System

4"/5"/6"/8" Wafer Etching System

System capable of processing multi-size wafer, 4", 5", 6" and 8" wafer.
Designed rigid to be compatible with high temperature ozone sulfate.
2 sets of built-in spin dryer capable of drying 2 sizes, thus dry 4 sizes.
As size is automatically judged and tooling change is not necessary, suitable for small lot production.

6"/8" Cassette-less Cleaning System

6"/8" Cassette-less Cleaning System

Capable of performing cassette-less process of both 6" wafer and 8" wafer.
For drying process, original lift-up drying system is equipped, and 2-size multi-design requires no tooling change. In addition to 6/8" , system for both 5/6" also can be produced.

Large Part Precision Cleaning System

Large Part Precision Cleaning System

Large system for precision cleaning of metal parts. Perform setting part in basket and ultrasonic cleaning in large dipping tank. For rinsing, usable for complicated shape by jet flow method with special nozzle. For drying, in addition to hot air circulation with built-in HEPA filter, air blow system by movable nozzle is adopted. Restrain waterdrop from being carried into oven.

Wafer・Chip Apperance Inspection System

Wafer・Chip Apperance Inspection System

Wafer・Chip Apperance Inspection System / Realized lobor saving by high throughput Micro-crack・Chipping・Foreign Matter Inspection・Pattern Defect, etc.
For Si Wafer, Compound Wafer, Glass, etc.
/ Inspection of Warped wafer・Post-dicing chip

  • Automatic judging function : Map data saving function
  • Resolution : 1.5μm

N2 Compact Size Reflow

N2 Compact Size Reflow

Total length : 2.5mm, 6 zones, Realized compact size/For package such as BGA/CSP, etc.

  • Max 350℃(±2.5℃)
  • Applicable : Max250×230mm
  • In-oven oxygen density : 50ppm~
  • 3phase, 200V 20kW
  • Hot air circulation + Far-infrared usable
  • Outer dimension : 2500×1040×1340mm

Table-top N2 Reflow System

Table-top N2 Reflow System

Table-top N2 Reflow System

Conveyer type & Batch type, Heating oven / Max 400℃, Max width : 340mm

  • With window to observe the inside of oven
  • 200VAC 3phase 50/60HZ
  • Nitrogen gas, With excessive temperature rise prevention sensor

PC Substrate Cleaner

PC Substrate Cleaner

Remove dust・powder・burr on printed substrate / Rotating brush+Suction unit type

  • Rotating brush+2 rubber rolls+Adhesive tape
  • Width 50~250mm/Length 100~330mm
  • Object thickness : 0.5~2.0mm
  • Outer dimension : 620×390×1260mm
  • Connectable to front- and back-end of SMT line system
  • Using both neutralizing apparatus (Top of inlet/outlet) and air-blow

Laser Scriber

Laser Scriber

Scriber for sapphire, GaN, SiC and crystal wafer, etc.

  • High-speed throughput
  • Realized 800mm/sec
  • Debris-less process
  • Usable for warp・uneven thickness of wafer
  • For Φ2~Φ6 inch ※Patent Pending